HDI
High-Density Interconnect (HDI) Flexible Printed Circuit for FS & FST Series Modules
1. Product Overview
This product is a high-precision High-Density Interconnect (HDI) flexible printed circuit of the FS & FST series, designed with a multi-panel array structure for mass manufacturing. It integrates advanced HDI process technology, featuring ultra-fine line width/spacing, micro-vias, and high integration density. With excellent flexibility, bending resistance, and stable electrical performance, it is specially developed for miniaturized, high-speed, and high-reliability electronic applications.
2. Core Specifications
| Item | Parameter Details |
|---|---|
| Product Model | FS & FST Series HDI FPC |
| Circuit Structure | Multi-panel array (single-piece integrated molding for mass production) |
| HDI Process Level | Micro-via HDI (laser-drilled vias, stacked/via-in-pad available) |
| Base Material | Polyimide (PI) + Copper Foil (standard: 1oz/0.5oz electrolytic copper; optional) |
| Coverlay Material | Polyimide (PI) coverlay / Solder mask (selectable per application) |
| Minimum Line Width/Spacing | ≤3mil/3mil (customizable for ultra-fine HDI requirements) |
| Minimum Via Diameter | Laser micro-via: ≤4mil (mechanical via optional for non-HDI areas) |
| Number of Layers | 1-4 layers (customizable for multi-layer HDI FPC) |
| Bending Performance | Dynamic bending ≥10,000 times; static bending radius ≥0.3mm |
| Surface Finishing | Immersion Gold (ENIG), Immersion Silver, HASL, or OSP (customizable) |
| Operating Temperature | -40°C ~ +125°C (industrial grade; high-temp version up to 150°C available) |
| Storage Temperature | -50°C ~ +150°C |
| Dielectric Strength | ≥3kVAC (1min, no breakdown) |
| Insulation Resistance | ≥10¹² Ω (normal environment) |
3. Core Features
- HDI High Integration: Adopts laser micro-via and fine-line process, realizing high-density wiring and miniaturized component assembly.
- Excellent Flexibility: PI-based flexible substrate supports dynamic/static bending, adapting to curved/limited-space assembly.
- Stable Electrical Performance: Low impedance, high signal integrity, suitable for high-speed signal transmission.
- Mass Production Compatibility: Multi-panel array design optimizes SMT mounting and automated production efficiency.
- Reliability: High temperature/humidity resistance, anti-vibration, and long-term service stability.
4. Typical Applications
- Consumer electronics (smartphones, tablets, wearable devices, cameras)
- Automotive electronics (in-vehicle sensors, infotainment systems, LED lighting modules)
- Industrial control (precision sensors, miniaturized control modules)
- Medical devices (portable medical equipment, wearable health monitors)
- IoT terminals (miniature communication modules, sensing devices)
5. Notes
- Customization services for parameters (layer count, line width, surface finishing, bending radius) are available per customer requirements.
- Storage and handling: Avoid scratches, moisture, and mechanical stress; store in a dry, dust-free environment (humidity ≤60%RH).
- Soldering process: Compatible with lead-free reflow soldering (peak temperature ≤260°C, duration ≤30s).
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