FS & FST High-Reliability PCB for Aerospace & Data Center Equipment

1. Product Overview

2. Basic Specifications

3. HDI Core Technical Parameters

4. Material Performance

• Base Material: FR-4 (Tg ≥ 130°C), High-Tg FR-4 (Tg ≥ 170°C) for high-temperature applications;
• Dielectric Constant (Dk): 4.2 ± 0.1 (1MHz)
• Dissipation Factor (Df): ≤ 0.02 (1MHz)
• Thermal Conductivity: ≥ 0.3 W/m·K
• Flammability Rating: UL94 V-0

5. Environmental & Reliability Requirements

5.1 Operating Conditions

• Operating Temperature: -40°C to +125°C
• Storage Temperature: -50°C to +150°C
• Humidity: 5% – 95% RH (Non-Condensing)

5.2 Reliability Testing

• Thermal Cycling: -40°C ↔ +125°C, 1000 cycles, no delamination or crack;
• Solderability: Pass 260°C ± 5°C reflow soldering (3 times), no blistering or peeling;
• Ionic Contamination: ≤ 1.56 μg/cm² (NaCl equivalent);
• Impedance Control: ±10% (per customer impedance requirements);
• Peel Strength: ≥ 1.0 N/mm (copper foil to base material).

6. Quality & Compliance Standards

• Design Standard: IPC-2226 (HDI PCB Design Standard)
• Manufacturing Standard: IPC-A-600 (Class 2 / Class 3 Optional)
• Acceptance Standard: IPC-6012 (Class 2 / Class 3)
• RoHS Compliance: Compliant with RoHS 2.0 (2011/65/EU)
• REACH Compliance: Compliant with EU REACH Regulation (SVHC Free)

7. Packaging & Shipping

• Packaging: Anti-static bag + vacuum packaging + carton box (with moisture-proof and shock-proof materials);
• Labeling: Model, quantity, production date, batch number, and customer information;
• Shipping: Moisture-proof and anti-static transportation, suitable for air/sea freight.

8. Customization Service

• Customizable board thickness, layer count, line width/spacing, surface finish, and color;
• Support for blind/buried via, stacked via, and other HDI structures;
• Provide PCB design consultation, Gerber file optimization, and prototype to mass production services.

9. Notes

• The above specifications are standard configurations; contact us for customized parameters;
• Customer shall provide complete Gerber files, impedance requirements, and special process notes before production;
• Quality inspection is conducted per IPC standards, and non-conforming products are not allowed to leave the factory.